Leader in Micro-Assembly
Technological miniaturisation and functional integration in microelectronics and optoelectronics are essential for future-oriented product innovations. Micro-assembly and assembly and connection technology play a crucial role in the realization of these technological innovations in new and marketable products.
We have developed the T-7000 to successfully realize these requirements. The platform offers sub-micron placement accuracy, a travel range of 500 x 700 mm and a bonding head with minimum bonding forces of up to 0.01 N. On customer request, the bonding force range can be optionally increased to 100 N, 300 N or 500 N.
This model covers all common bonding technologies.
Technical Data
Working Area with Wafer Table | 500 mm x 700 mm |
Possible Wafer Sizes | up to 8″ (ring & frame) |
Travelling Range Z-axis | 100 mm |
Tool Rotation Max. | up to 360° |
Bond Force Range | 0.01 N – up to 300 N * |
Axis Speed | up to 2.0 m/sec |
Positioning Accuracy | < 1.0 μm @ 3 sigma |
Axis Resolution | XYZ: 0.001 μm, theta: 0.005° |
Min/Max. Chip Size | smaller than 0.05 mm |
Acceleration | up to 2.5 G |
Product highlights
- Manual mode
- Multichip capable
- Post-bond inspection
- Software-programmed temperature control
- Wafer mapping
- OCR
- Traceability
- MES
- Automated dispensing needle calibration
- Customised splitting
- Scrubbing
- Various image recognition
- Bonding in cavities (15 mm)
- Preform punching
Modules &
 Options
- Air-suspended bond head
- Vibration feeder
- Wafer handling system
- Stamping module
- Component feeders
- Formic Acid Module
- Wafer table with DIE ejector
- UV indexer
- WRGB ring light
- Heating plates (up to 450°C; ΔT ramps up to 60 K/s)
- Inert gas
- Formic acid module
- Automatic tool change
- Various dispensing technologies
- Stamping unit
- Tool heating
- Various feeder widths
- Uplooking camera
- ID scanner
- DIE flipping unit
- Heated inert gas
- Automatic wafer change
- Magazine feeder
- Inline production
Bonding Solutions
- Epoxy Bonder
- UV Bonder
- Ultrasonic Bonder
- Thermocompression Bonder
- Sinter Bonder
- Flip Chip Bonder
- Eutectic Bonder
- 3D Bonder
- Photonics Bonder