- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
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- Sintering Presses
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- Materials
SOLARIS 150mm UV RTP
Main Features:
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Wafer handling: Manual loading of wafer into the oven, single wafer processing
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Wafer sizes: 2″, 3″, 4″, 5″, 6″
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Ramp up rate: 1-150°C per second, user-controllable.
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Recommended steady state duration: Unlimited, dependent on Temp & cooling
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Ramp down rate: Temperature Dependent, max 150°C per second.
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Recommended steady state temperature range: RT – 1200°C
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Temperature accuracy: +1.78°C total errors
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Thermocouple temperature accuracy: +1.1°C
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Temperature repeatability: +2°C or better at Steady State
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Temperature uniformity: +2.5°C or better across a 6″ (150 mm) wafer at 1150°C.
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For a titanium silicidation process, no more than 4% increase in non-uniformity
     during the first anneal at 650°C to 700°C.
Description
Overview
The Solaris 150UV is a standalone unit or an added option for the Solaris 150 RTP System.
Applications​
The Solaris RTP system is a versatile tool that is useful for many applications:
- Pre Gate Oxidation Cleaning
- Pre-Epi Cleaning
- Photoresist Descum
- Growth of Sacrificial Oxides
- Bond Pad Cleaning
- Cleaning of Critical Surfaces
- Hydrocarbon Removal
- High Temperature UV/Ozone Densification