- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Diffusion and LPCVD Furnaces
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Wet Process & Plating Tool
- Vacuum Chamber
- Electron Beam & Photo Resist
- Deposition Materials
Wafer Plating Tool µGALV-W
Wafer Plating Tool
- Suitable for deposition application in the field of microtechnology and semiconductors including TSV fill, RDL, Pads, Contacts, Pillars, etc.
- Designed for the use in cleanrooms, the shell is made of Polypropylen (natural)
- Modular structure, standard: one process cell with one wash cell, extension to build up process lines is possible
- Additional process cells could be integrated, made of Polypropylen (natural)
- Different Waferdiameters are processable in one process cell, up to 12″
- Different process cells like Rack Plater, Cup Plater or Jet Plater are available
- Electroplating of Au (Pads or Contacts, cyanide or cyanide-free), Ni, Cu (Redistribution Layer RDL, Pillar, TSV fill), Indium, Sn and Sn-alloys (like SnPb, SnAg), NiFe, NiCo, NiW, SnPb
- Electro less plating of Ni, Cu, Au, NiP, SnPb
- The electroplating process runs automatically, all process parameters like pH, Temperature, flow rate,… are controlled.
- Rinsing cell or Quick Dump Rinser
- Automation for handling single wafers possible, Customized solutions are possible
- Control of the system by using a Touch Panel
