- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Diffusion and LPCVD Furnaces
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Wet Process & Plating Tool
- Vacuum Chamber
- Electron Beam & Photo Resist
- Deposition Materials
AL 36 Tabletop Unit
AL stands for aluminum chamber. It is mainly used in the semiconductor, solar, plastics and electronics industries.
For activating plastic and metal surfaces or for creating high-purity surfaces.
Application examples: Pretreatment of metal and plastic parts prior to bonding, gluing, painting or printing, ultra-fine cleaning of glasses, metals, ceramics or other vacuum-compatible substrates.
Description
Slightly bigger version of the AL18 with more options and load capacity
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Dimensions:
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L: 680mm W: 630mm H: 650mm
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Weight:
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110 KG
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Volume:
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36 Liter
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Process chamber:
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aluminium, L: 350mm W: 320mm H: 320mm
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Microwave output:
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2,45 GHz / 50 – 1200 Watt
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Inclusive:
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1 gas channel (gas distribution system inside the process chamber), up to 3 channels available
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Substrate holder (optional):
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aluminium, custom design possible
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Vacuum connection:
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DN 25 ISO-KF
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Venting:
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electromagnetic solenoid valve
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Pump system:
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15-65 m³/h
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Chamber door:
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hinged-type with viewing port
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