- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Vacuum Chamber
- Materials
Spin Rinse Dryer
M Tek SRDs are available in Double Stack, Single Stack, and Benchtop Models and in three different model of S, F and ST for wafer size up to 12″.
Category: Spin Rinse Dryer
Tags: MEMS, nanofabrication, semiconductor, spin rinse dryer, wafer cleaning
Description
M Tek SRDs are available in Double Stack, Single Stack, and Benchtop Models
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S Model
Key Features
Brushless Motor
Labyrinth Seal
Rotor - Quick Disconnect
Controller - 102 or 101
Plastic (Aero Style)
F Model
Key Features
Brushless Motor
Ferrofluidic Seal
Rotor - 4 Bolt
Controller - 101
Plastic (Block Style)
ST Model
Key Features
Brushless Motor
Ferrofluidic Seal
Rotor - 4 Bolt
Controller - 328
Plastic (Block Style)