- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Vacuum Chamber
- Materials
Delta Printing System
- Stand-alone, open platform
- For prototyping and small-volume/nest production
- Freedom of control over printhead
- Flexibility of user Interface: manual mode, CAD import, advanced scripting
- Fast & easy exchange of cartridges & nozzles
Description
Printing on the edge
- Edge interconnections printing
- High resolution traces, below 10 µm
- Possibility to print over the edge of glass, silicon and flexible foils
Redistribution layer prototyping
- All printed RDL structure
- Down to 1 μm / 1 μm L/S density
- Variable materials possible to use in one system, for example metallic nanoparticle paste and high viscous polyimide
Chip interconnection
- Reliable connection for flexible hybrid electronics and advanced IC packages
- High density interconnections on stacked chips
- Resolution <10 μm/10 μm L/S
- No satellite droplets and line width homogeneity to prevent electrical shorts
Prototype microelectronic devices with exceptional precision using our XTPL® Delta Printing System and high-viscosity conductive inks.
You can find more information here
