- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Diffusion and LPCVD Furnaces
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Wet Process & Plating Tool
- Vacuum Chamber
- Electron Beam & Photo Resist
- Deposition Materials
Description
The biggest system in our Q-series. Perfect for multiple Wafers with sizes up to 200mm diameter
Dimensions:
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L: 760mm W: 775mm H: 775mm
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Weight:
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100 KG
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Volume:
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20 Liter
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Process chamber:
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quartz glass, 240mm Ø, B: 450mm
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Microwave output:
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2,45 GHz / 50 – 1200 Watt
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Inclusive:
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1 gas channel (gas distribution system inside the process chamber), up to 3 channels available
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Substrate holder (optional):
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aluminium, custom design possible
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Vacuum connection:
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DN 40 ISO-KF
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Venting:
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electromagnetic solenoid valve
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Pump system:
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up to 40m³/h
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Chamber door:
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you can choose between hinged-type with viewing port and drawer door with attached support rods
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Wafer size:
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up to 200mm, at a number of 50 wafers
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