- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Vacuum Chamber
- Materials
SP 300
The fully automatic SP 300 sintering press can be used to produce sintered joints under inert and reduced atmospheres on an area up to 220 mm x 180 mm with an adjustable force up to 300 kN. The sintering force is generated by a combination of servo-electric drive and load cell. The advantage of this variant is that the set force value is adjusted very quickly and very accurately within the entire range. The absence of hydraulic components eliminates the risk of uncontrolled oil leakage in the production area.
Category: Sintering Presses
Tags: Budatec, semiconductor, Sintering
Description
Technical Data
Work area: 180 x 225 mm2
Height btw. punch plates: 75 mm
Pressing force: 0,5 – 300 kN
Force ramp: 1 – 100 kN/sec
Max. punch temperature: 350°C
Process atmosphere: N2Â /Â N2H2 (95/5)Â /Â H2 (up to 100%)Â /Â O2 (without H2)
Power supply: 400 V / 50 A
Cooling Water: 20 slm
Features
- Non-hydraulic force generation, ideal for cleanroom requirements
- Graphical overview of process components
- Digital manual integrated in the software
- Maintenance reminder
- Proposal for changing necessary components at the end of lifetime
- Monitoring of energy consumption (Industry 4.0)
- Optional pre-/post heating-/coolingplate
- Optional vacuum module
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