- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Diffusion and LPCVD Furnaces
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Wet Process & Plating Tool
- Vacuum Chamber
- Electron Beam & Photo Resist
- Deposition Materials
SP 60
By using the SP 60 sintering press, our VS 320 vacuum soldering system can be extended to a combined system. With this combination, the production of sintered joints under inert or reduced atmospheres is possible on an area up to 60 mm x 60 mm with an adjustable force up to 15 kN. The use of defined atmospheres during the sintering process leads to a significant improvement of the joint in terms of reliability and strength (multiplying of shear forces).
