- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Diffusion and LPCVD Furnaces
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Wet Process & Plating Tool
- Vacuum Chamber
- Electron Beam & Photo Resist
- Deposition Materials
VS 160
The VS 160 vacuum soldering system has a heating plate size of 160 mm x 160 mm and offers highest performance with a small footprint due to its high heating and cooling rates in the range of 200 K/min. The VS 160 can be used for research and development as well as for the production of smaller batches under production conditions.
The system is available in 2 variants. As a VS 160 S (benchtop) and as a VS 160 UG (with a base frame). This makes it possible to integrate additional options such as a vacuum pump or HCOOH gas line.
Description
VS 160 S (benchtop) Technical Data:
- Plate size: 160 x 160 mm2
- Chamber height: 50 mm
- Max. soldering temperature: 450 °C
- Heating- / Coolingramp: 3 K/s
- Max. load: 2,5 kg
- Process atmosphere: N2 / N2H2 (95/5)
- Power supply: 400 V / 16 A
- Cooling Water: 10 slm
VS 160 S (benchtop)Features:
- Gasflow programmable (inlet via proportional valve)
- Process-Control via separate thermocouples
- Graphical overview of process components
- Digital manual integrated in the software
- Maintenance reminder
- Proposal for changing necessary components at the end of lifetime
VS 160 UG (with a base frame) Technical Data:
- Plate size: 160 x 160 mm2
- Chamber height: 50 mm
- Max. soldering temperature: 450 °C
- Heating- / Coolingramp: 3 K/s
- Max. load: 2,5 kg
- Process atmosphere: N2 / N2H2 (95/5) / HCOOH
- Power supply: 400 V / 16 A
- Cooling Water: 10 slm
VS 160 UG (with a base frame) Features:
- Gasflow programmable (inlet via proportional valve)
- Process-Control via separate thermocouples
- Graphical overview of process components
- Digital manual integrated in the software
- Maintenance reminder
- Proposal for changing necessary components at the end of lifetime
