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VS160SVS160UG-_01-1024x805

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VS 160

The VS 160 vacuum soldering system has a heating plate size of 160 mm x 160 mm and offers highest performance with a small footprint due to its high heating and cooling rates in the range of 200 K/min. The VS 160 can be used for research and development as well as for the production of smaller batches under production conditions.

The system is available in 2 variants. As a VS 160 S (benchtop) and as a VS 160 UG (with a base frame). This makes it possible to integrate additional options such as a vacuum pump or HCOOH gas line.

Category: Vacuum Soldering Systems Tags: Budatec, semiconductor, soldering

Description

Description

VS 160 S (benchtop) Technical Data:

Plate size: 160 x 160 mm2
Chamber height: 50 mm
Max. soldering temperature: 450 °C
Heating- / Coolingramp: 3 K/s
Max. load: 2,5 kg
Process atmosphere: N2 / N2H2 (95/5)
Power supply: 400 V / 16 A
Cooling Water: 10 slm

VS 160 S (benchtop)Features:

Gasflow programmable (inlet via proportional valve)
Process-Control via separate thermocouples
Graphical overview of process components
Digital manual integrated in the software
Maintenance reminder
Proposal for changing necessary components at the end of lifetime

VS 160 UG (with a base frame) Technical Data:

Plate size: 160 x 160 mm2
Chamber height: 50 mm
Max. soldering temperature: 450 °C
Heating- / Coolingramp: 3 K/s
Max. load: 2,5 kg
Process atmosphere: N2 / N2H2 (95/5) / HCOOH
Power supply: 400 V / 16 A
Cooling Water: 10 slm

VS 160 UG (with a base frame) Features:

Gasflow programmable (inlet via proportional valve)
Process-Control via separate thermocouples
Graphical overview of process components
Digital manual integrated in the software
Maintenance reminder
Proposal for changing necessary components at the end of lifetime

Find more information here.