- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Vacuum Chamber
- Materials
VS 320
The vacuum soldering system VS 320 is a good choice for the production of medium and large batches due to the heating plate size of 320 mm x 320 mm and the high achievable performance.
A variety of options are available for the VS 320, such as hydrogen (concentration adjustable up to 100 %), HCOOH, special gases, microwave plasma and the integration of our sintering press. Thats a reason why it is also frequently used in research and development.
Description
Technical Data
Plate size: 320 x 320 mm2
Chamber height: 100 mm
Max. soldering temperature: 450 °C
Heating- / Coolingramp: 2 K/s
Max. load: 15 kg
Process atmosphere: N2Â /Â N2H2 (95/5)Â /Â HCOOHÂ /Â H2 (up to 100%)Â /Â Plasma (Microwave)
Power supply: 400 V / 32 A
Cooling Water: 20 slm
Features
- Process-Control via separate thermocouples
- Graphical overview of process components
- Digital manual integrated in the software
- Maintenance reminder
- Proposal for changing necessary components at the end of lifetime
- Power monitoring to detect defective heating rods
- Monitoring of energy consumption (Industry 4.0)
- Optional manipulation inside the chamber
- Optional sintering device SP 60
- Optional MES protocol: SECS/GEM, OPC-UA, etc
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