- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Diffusion and LPCVD Furnaces
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Wet Process & Plating Tool
- Vacuum Chamber
- Electron Beam & Photo Resist
- Deposition Materials
VS 320 i
This flexibly integrable vacuum soldering system with autonomous loading and unloading of product carriers is based on the VS 320 with all available options.
Description
Technical Data
Plate size: 320 x 320 mm2
Chamber height:100 mm
Max. soldering temperature: 450 °C
Heating- / Coolingramp: 2 K/s
Max. load: 15 kg
Process atmosphere: N2Â /Â N2H2 (95/5)/Â HCOOHÂ /Â H2 (up to 100%)
Power supply: 400 V / 32 A
Cooling Water: 20 slm
Features
- Handling via y – z – system and transport belt
- Graphical overview of process components
- Digital manual integrated in the software
- Maintenance reminder
- Proposal for changing necessary components at the end of lifetime
- Power monitoring to detect defective heating rods
- Monitoring of energy consumption (Industry 4.0)
- Optional automatic HCOOH-bubbler refill
- Optional second transport belt
