- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Diffusion and LPCVD Furnaces
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Wet Process & Plating Tool
- Vacuum Chamber
- Electron Beam & Photo Resist
- Deposition Materials
VS XL
The VS XL vacuum soldering system can be used for processing large parts and large batches due to the heating plate size of 1000 mm x 320 mm.
In addition to the available options hydrogen (concentration adjustable up to 100 %), HCOOH and special gases as well as motor-driven manipulators can be integrated within the workspace
Description
Technical Data
Plate size: 1000 x 320 mm2
Chamber height:100 mm
Max. soldering temperature: 350 °C
Heating- / Coolingramp: 1,5 K/s
Max. load: 45 kg
Process atmosphere: N2Â /Â N2H2 (95/5)Â /Â HCOOHPower supply: 400 V / 64 A
Cooling Water: 20 slm
Features
- Process-Control via separate thermocouples
- Graphical overview of process components
- Digital manual integrated in the software
- Maintenance reminder
- Proposal for changing necessary components at the end of lifetime
- Power monitoring to detect defective heating rods
- Monitoring of energy consumption (Industry 4.0)
- Optional manipulation inside the chamber
- Optional MES protocol: SECS/GEM, OPC-UA, etc
