- Bonder & Flip Chip
- Atmospheric Plasma Cleaner
- Vacuum Plasma Cleaner
- Spin Rinse Dryer
- Dispensing & Micro/Nano Printing System
- Lithography Process Systems
- Diffusion and LPCVD Furnaces
- Rapid Thermal Processing & Annealing
- Vacuum Soldering Systems
- Parylene Coating System
- Deposition System
- Hollow Cathode Plasma Source
- Plasma Etching System
- Sintering Presses
- Wet Process & Plating Tool
- Vacuum Chamber
- Electron Beam & Photo Resist
- Deposition Materials
Plasma cleaning and polymerization tool (cluster system)
A robotic-powered, multi-chamber system for the most complex coating processes in a low-pressure environment.
Description
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Dimensions:
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L: 2000mm W: 1800mm H: 2000mm
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Weight:
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~ 320 KG
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Volume:
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50 litres
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3 process chambers:
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VA L:300 W:300 H:300
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Plasma source:
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2,45 GHz, 1200 Watt / 13,56 MHz, 600 Watt
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Inclusive:
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3×3 gas channels (gas distribution system inside the process chamber)
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Additionally:
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air lock robot, example substrate holder for air lock
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Substrate holder (optional):
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Aluminum, customized design possible
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Vacuum connection:
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DN 63 ISO-KF
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Venting:
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electromagnetic solenoid valve
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3 Pump systems:
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40m³/h
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Chamber door:
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Maintenance chamber doors
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