amc 2000

workhorse, designed for flexible use or very high throughput

Highly flexible machine configuration and processing of different wafer sizes:

• Wafer diameters: 2“ to 8“
• Up to 4 I/O stations for substrates 2“ to 8“ (max. 4x open carriers or 2x SMIF) or
• Max. 5 individually selectable process modules
• 1 two-link wafer handler
• Outer dimension W x L: 1382 mm x 1596 mm