amc 2500

All-rounder for multiple processes & substrates

Compact service package for high throughput:

• Wafer diameter: 2“ bis 8“
• According to configuration of wafer handling up to 4 I/O-stations (max. 4 x open carriers or 3 x SMIF)
• Max. 7 individually selectable process modules
• 2 two-link wafer handlers or
• 1 two-link wafer handler on linear track
• Outer dimension: W x L: 1414 mm x 2048 mm