amc 2000 Fully automatic single-wafer processing
workhorse, designed for flexible use or very high throughput
Highly flexible machine configuration and processing of different wafer sizes:
- Wafer diameters: 2“ to 8“
- Up to 4 I/O stations for substrates 2“ to 8“ (max. 4x open carriers or 2x SMIF) or
- Max. 5 individually selectable process modules
- 1 two-link wafer handler
- Outer dimension W x L: 1382 mm x 1596 mm
