amc 2000 Fully automatic single-wafer processing

workhorse, designed for flexible use or very high throughput

Highly flexible machine configuration and processing of different wafer sizes:

  • Wafer diameters: 2“ to 8“
  • Up to 4 I/O stations for substrates 2“ to 8“ (max. 4x open carriers or 2x SMIF) or
  • Max. 5 individually selectable process modules
  • 1 two-link wafer handler
  • Outer dimension W x L: 1382 mm x 1596 mm

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