amc 2500 Fully automatic single-wafer processing

All-rounder for multiple processes & substrates

Compact service package for high throughput:

  • Wafer diameter: 2“ bis 8“
  • According to configuration of wafer handling up to 4 I/O-stations (max. 4 x open carriers or 3 x SMIF)
  • Max. 7 individually selectable process modules
  • 2 two-link wafer handlers or
  • 1 two-link wafer handler on linear track
  • Outer dimension: W x L: 1414 mm x 2048 mm

Download brochures here.