amc 1000

Transitional model to fully automatic low-scale production

Flexible machine configuration and processing of different wafer sizes:

• Wafer diameters: 2“ to 8“
• Up to 4 I/O stations for 2“ to 6“ (max. 4x open carriers or 2x SMIF) or
• Up to 2 I/O stations for 8“ (open carriers or SMIF)
• Max. 3 individually selectable process modules
• 1 two-link wafer handler
• Outer dimension W x L: 1236 mm x 1150 mm