SPTS Omega® with ICP Module
Plasma Etch Systems for a Wide Range of Materials
The SPTS Omega® ICP process module is highly flexible and etches a wide range of materials including GaAs, GaN, SiN, oxides, polymers, low aspect ratio Si and metals. The SPTS ICP process module uses a high density plasma source incorporating a radial coil design. Used in applications for RF devices and photonics/optoelectronics devices, the ICP process module is an enabling tool for the semiconductor industry. The ICP module is compatible with the Omega® LPX, c2L or fxP wafer handling platforms, or integrated with different SPTS etch and deposition modules on a Versalis™ cluster platform.
Description
Applications
- GaAs etch
- GaN etch
- SixNy etch
- BCB and Polyimide etch
- Metal etch
- Low aspect ratio Si etch
Markets
- RF Device Manufacturing
- Photonics
Benefits
- Flexible processing for a wide range of etch applications and materials
- Low damage etch processes
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