Xactix® e2
Benchtop XeF2 Vapor Etch System for R&D
The Xactix® e2 xenon difluoride (XeF2) etch system is an ideal solution for those seeking a low cost, benchtop R&D etching system. Isotropic etching of silicon using XeF2 is an ideal solution for releasing MEMS or photonic devices. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. Process flexibility is a key to successful research and the Xactix® e2 system provides the widest range of process options. The e2 offers ease of use, low cost of ownership, a small footprint and excellent process flexibility.
Description
Applications
R&D scale XeF2 etching
Markets
- MEMS
- Photonics
Benefits
- Low cost, easy to use, and reliable
- Great for working with small samples and wafers
- Includes the etch unit, PC with keyboard and mouse, flat panel display, pump, and manual
- Options to increase process flexibility
- Increased selectivity to SiN and SiO2
- Additional process gas can be added
- Pulsed and optional continuous flow etch processes
- Lower installation costs
- Easy field upgrades with options
Find brochures here.
