Xactix® CVE
XeF2 Vapor Etch Release System for High Volume Production
The Xactix® CVE xenon difluoride (XeF2) etch module has a unique chamber design which provides high etch rates, uniformity and efficiency. Isotropic etching of silicon using XeF2 is an ideal solution for releasing MEMS or photonic devices. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. The Xactix CVE module is compatible with the c2L or fxP cluster platforms, to allow high volume production and the integration of XeF2 modules with the other SPTS process modules available from KLA.
Description
Applications
- Vapor release etch of MEMS
- microLEDs
- RF membranes
Markets
- MEMS
- Photonics
- RF Device Manufacturing
Benefits
- Patented chamber design optimized for gas phase etching
- Edge lift to protect delicate double-sided wafers
- Temperature controlled chuck with optional backside helium for improved etch rates, uniformity and selectivity
- Easy conversion between 150 mm and 200 mm wafers
- Ability to clamp a wide variety of substrate thicknesses
- Wide range of wafer handling options
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