Xactix® X4
XeF2 Vapor Release Etch System
The Xactix® X4 xenon difluoride (XeF2) etch system features accelerated etch rates and superior components making it ideal for intensive R&D and pilot production. XeF2 shows high selectivity to silicon over almost all standard semiconductor materials including photoresist, silicon dioxide, silicon nitride and aluminum. The Xactix X4 system is easy to use, reliable and safe, it is the leading XeF2 etch system for releasing MEMS devices. Equipped with a patented dual expansion chamber design for high etch rates, the Xactix X4 system allows for high XeF2 gas flow and pressure without dilution from carrier gases. The system provides both pulsed and continuous flow etch processes. A unique expansion chamber-based design contributes to precise, repeatable pulse pressure and ease of mixing XeF2 with other gases. Customizable chamber size can be matched to the wafer size resulting in maximized etch rates, uniformity and efficiency.
Applications
- Vapor release etch of MEMS
- microLEDs
- RF membranes
Markets
- MEMS
- Photonics
- RF Device Manufacturing
Benefits
- Equipped with a patented dual expansion chamber design for high etch rates
- Allows for high XeF2 gas flow and pressure without dilution from carrier gases
- Provides both pulsed and continuous flow etch processes
- Unique expansion-chamber-based design contributes to precise, repeatable pulse pressure and ease of mixing XeF2 with other gases
- Customizable chamber size can be matched to the wafer size resulting in maximized etch rates, uniformity and efficiency
- Easy to use, reliable and safe
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