SPTS Omega® with SynapsEtch Module
Plasma Etch Systems for Strongly Bonded Materials
The SPTS Omega® SynapsEtch process module uses a high density plasma source to etch strongly bonded materials. The SPTS Omega SynapsEtch etch process module is heated and has a magnetic confinement chamber giving a higher plasma density than conventional ICPs (by a factor of ~10x). This higher plasma density means higher etch rates can be achieved for strongly bonded materials. The Omega SynapsEtch is routinely used for etching of deep features in dielectric materials including silicon oxide, quartz and glass. Other low volatility materials, such as SiC, AlScN, are also easily processed by the Omega SynapsEtch module. The Omega SynapsEtch is compatible with the LPX, c2L or fxP wafer handling platforms, or integrated with different SPTS etch and deposition modules on a Versalis™ cluster platform.
Applications
- Deep high rate oxide etching
- Glass etch
- High rate SiC etch
- SiN etch
- GaN etch
- PZT and AlScN etch
- Al2O3 etch
Markets
- MEMS
- RF Device Manufacturing
- Power Device Manufacturing
- Photonics
Benefits
- Unique source design creates high ion density for increased etch rate of strongly bonded materials
- Heated process chamber for improved mean time before clean (MTBC)
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