SPTS Mosaic™ with Rapier-S/Rapier-300S Module

Plasma Dicing Systems

Plasma dicing, using Deep Reactive Ion Etching (DRIE) processing, is a viable alternative to conventional singulation methods using saw blades or lasers. Plasma dicing offers considerable benefits to users, including narrower kerf widths that allow >80% more die per wafer (depending on die size). Cleaner processing improves yields in die-to-wafer hybrid bonding. Based on a chemical removal of material, plasma singulation increases die strength and improves die reliability in critical applications.

The SPTS Mosaic™ plasma dicing systems offer plasma singulation of die from a silicon wafer (up to 300mm, on frames). The Rapier-S module is based on the well-established “dual-source” Rapier module giving an extremely uniform and controllable plasma profile, and is capable of handling taped wafers on 296mm or 400mm frames. The SPTS Mosaic™ OHT cluster platform accommodates 4 process modules and is compatible with both 296/400mm frames and 200/300mm wafers (in parallel) and includes an industry-standard EFEM with 2/3 loadports which can receive overhead transport.